BGA Reballing Accessories

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管理首页 > Products > BGA Reballing Accessories

Supply BGA Reballing Kit
BGA Reballing kit
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BGA Soldering Flux
Soldering flux can be widely used in PCB mainboards of diffirent kinds such as computer, notebook, Xbox 360, PS3, PSP, cell phones, automobiles ...
It is used with BGA solder balls

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BGA Leaded & Lead Free Solder Balls
BGA solder balls: leaded solder balls for leaded BGA Rework, melting point 183 degrees. Lead-free solder balls are used for lead-free rework.

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BGA Reballing Station Manufacturer
BGA reballing stations for doing BGA reballing of notebook, Xbox360, notebook, xbox 360, PS3, Wii, PSP, and cell phones. We have diffirent BGA reballing stations for your selection.

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PS3 XBOX 360 Mainboard Supports
PS3 XBOX360 Mainboard Supports for xbox 360 fat, xbox 360 slim, PS3 40GB/60GB, PS3 slim 80GB, PS3 120GB
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BGA Stencil, BGA Reballing Stencil Kit Template Manufacturer
BGA reballing stencil kit are must for bga reballing. We have latest and diffirent kinds for notebook chips, xbox 360 chips, PS3 chips, Wii Chips, cell phone chips...and also universal bga reballing stencil kit are availble.

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Other BGA Reballing ACC
Other BGA reballing accessories such as ESD tweezers,ESD gloves,heatsink material,vacuum suction pens, hign temperature tapes, Foil tapes, desoldering wires,solder wick, BGA scrapers...

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Main Products

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ACHI HR560, Most C..

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Latest ACHI HR1500..

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OMEGA K-type Therm..

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Supply BGA Reballi..

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BGA Soldering Flux..

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BGA Leaded & L..

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